|
No. |
豁免內容 |
豁免項 |
范圍及到期日 |
|
1 |
Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
單端（小型）熒光燈所使用的汞含量不得超過（每盞燈）: |
Hg |
|
|
1(a) |
For general lighting purposes < 30 W: 5 mg
一般照明用途<30W:5 mg |
Hg |
到期:2011/12/31
3.5mg:2012/01/01~2012/12/31
2.5mg:2013/01/01起 |
|
1(b) |
For general lighting purposes ≥ 30 W and < 50 W: 5 mg
一般照明用途≥30W且<50W:5 mg |
Hg |
到期:2011/12/31
3.5mg:2012/01/01起 |
|
1(c) |
For general lighting purposes ≥ 50 W and < 150 W: 5 mg
一般照明用途≥ 50 W and < 150 W: 5 mg |
Hg |
|
|
1(d) |
For general lighting purposes ≥ 150 W: 15 mg
一般照明用途≥ 150 W: 15 mg |
Hg |
|
|
1(e) |
For general lighting purposes with circular or square structural shape and tube diameter ≤17 mm
一般照明用途，為圓形或方形結構，且管徑≤17 mm |
Hg |
到期:2011/12/31
7mg:2012/01/01起 |
|
1(f) |
For special purposes: 5 mg
特殊用途: 5 mg |
Hg |
|
|
2(a) |
Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):
用于一般照明的雙端直線型災光燈，所使用的汞含量不得超過(每盞燈): |
Hg |
|
|
2(a)1 |
Tri-band phosphor with normal lifetime and a tube diameter > 9 mm (e.g. T2): 5 mg
一般壽命的三波長熒光燈，其管徑> 9 mm (例如 T2): 5 mg |
Hg |
到期:2011/12/31
4mg:2012/01/01起 |
|
2(a)2 |
Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mg
一般壽命的三波長熒光燈，其管徑≥ 9 mm 且 ≤ 17 mm (例如 T5): 5 mg |
Hg |
到期:2011/12/31
3mg:2012/01/01起 |
|
2(a)3 |
Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 5 mg
一般壽命的三波長熒光燈，其管徑> 17 mm and ≤ 28 mm (例如 T8): 5 mg |
Hg |
到期:2011/12/31
3.5mg:2012/01/01起 |
|
2(a)4 |
Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12): 5 mg
一般壽命的三波長熒光燈，其管徑 > 28 mm (例如T12): 5 mg |
Hg |
到期:2012/12/31
3.5mg:2013/01/01起, |
|
2(a)5 |
Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mg
長壽命(≥ 25 000 h)的三波長熒光燈: 8 mg |
Hg |
到期:2011/12/31
5mg:2012/01/01起 |
|
2(b) |
Mercury in other fluorescent lamps not exceeding (per lamp):
其它熒光燈，所使用的汞含量不得超過(每盞燈): |
Hg |
|
|
2(b)1 |
Linear halophosphate lamps with tube > 28 mm (e.g. T10 and T12): 10 mg
直線型磷酸熒光燈，其管徑> 28 mm (例如T10 和 T12): 10 mg |
Hg |
到期:2012/04/13 |
|
2(b)2 |
Non-linear halophosphate lamps (all diameters): 15 mg
非直線型磷酸熒光燈(所有管徑): 15 mg |
Hg |
到期:2016/04/13 |
|
2(b)3 |
Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9)
非直線型三波長熒光燈，其管徑> 17 mm (例如 T9) |
Hg |
豁免到期:2011/12/31
15mg:2012/01/01起 |
|
2(b)4 |
Lamps for other general lighting and special purposes (e.g. induction lamps)
其它一般照明或特殊用途的燈(如感應燈) |
Hg |
豁免到期:2011/12/31
15mg:2012/01/01起 |
|
3 |
Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
特殊用途的冷陰極熒光燈(CCFL)和外部電極熒光燈(EEFL),所使用的汞含量不得超過(每盞燈): |
Hg |
|
|
3(a) |
Short length (≤ 500 mm)
較短長度(≤ 500 mm) |
Hg |
豁免到期:2011/12/31
3.5mg:2012/01/01起 |
|
3(b) |
Medium length (> 500 mm and ≤ 1 500 mm)
中等長度 (> 500 mm and ≤ 1 500 mm) |
Hg |
豁免到期:2011/12/31
5mg:2012/01/01起 |
|
3(c) |
Long length (> 1 500 mm)
較長長度(> 1 500 mm) |
Hg |
豁免到期:2011/12/31
13mg:2012/01/01起 |
|
4(a) |
Mercury in other low pressure discharge lamps (per lamp)
其它低壓放電燈中汞含量(每盞燈) |
Hg |
豁免到期:2011/12/31
15mg:2012/01/01起 |
|
4(b) |
Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60:
一般照明用途的高壓鈉(蒸氣)燈, 其演色性指數Ra>60, 所使用的汞含量不得超過(每盞燈): |
Hg |
|
|
4(b)1 |
P ≤155 W |
Hg |
豁免到期:2011/12/31
30mg:2012/01/01起 |
|
4(b)2 |
155 W < P ≤ 405 W |
Hg |
豁免到期:2011/12/31
40mg:2012/01/01起 |
|
4(b)3 |
P > 405 W |
Hg |
豁免到期:2011/12/31
40mg:2012/01/01起 |
|
4(c) |
Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):
一般照明用途的其它高壓鈉(蒸氣)燈，所使用的汞含量不得超過(每盞燈): |
Hg |
|
|
4(c)1 |
P ≤155 W |
Hg |
豁免到期:2011/12/31
25mg:2012/01/01起 |
|
4(c)2 |
155 W < P ≤ 405 W |
Hg |
豁免到期:2011/12/31
30mg:2012/01/01起 |
|
4(c)3 |
P > 405 W |
Hg |
豁免到期:2011/12/31
40mg:2012/01/01起 |
|
4(d) |
Mercury in High Pressure Mercury (vapour) lamps (HPMV)
高壓汞(蒸氣)燈(HPMV)中使用的汞含量 |
Hg |
到期:2015/04/13 |
|
4(e) |
Mercury in metal halide lamps (MH)
含鹵素合金 (MH)的燈，所使用汞的含量 |
Hg |
|
|
4(f) |
Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex
其它未在此附錄中提及的特殊用途放電燈，其所含的汞 |
Hg |
|
|
5(a) |
Lead in glass of cathode ray tubes
陰極射線管中的玻璃可含鉛 |
Pb |
|
|
5(b) |
Lead in glass of fluorescent tubes not exceeding 0,2 % by weight
熒光燈的玻璃含鉛不得超過重量的0,2 % |
Pb |
|
|
6(a) |
Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0,35 % lead by weight
鉛用于加工用途的鋼材及鍍鋅鋼中，作為合金元素之一，其含量最高不得超過0,35 % |
Pb |
|
|
6(b) |
Lead as an alloying element in aluminium containing up to 0,4 % lead by weight
鉛用于鋁合金，作為合金元素之一，其含量最高不超過 0,4 % |
Pb |
|
|
6(c) |
Copper alloy containing up to 4 % lead by weight
銅合金中所含鉛，最高不得超過4.0 % |
Pb |
|
|
7(a) |
Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
高熔點類的焊錫，其所含的鉛豁免(如鉛為基底的合金，其鉛含量大于85%) |
Pb |
|
|
7(b) |
Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching,
signalling, transmission, and network management for telecommunications
服務器、儲存裝置和陣列系統裝置中使用的焊錫，或架設網絡設備中用到的如開關，信號裝置，傳輸裝置或電信網絡設備中所會用到的焊錫，其焊錫中的鉛 |
Pb |
|
|
7(c)1 |
Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound
鉛用于電器及電子元件的玻璃或陶瓷(介電陶瓷,電容除外)。例如:壓電裝置, 或玻璃, 或陶瓷復合材料 |
Pb |
|
|
7(c)2 |
Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
額定電壓為125V AC或250V DC或者更高的電容，其內的介電陶瓷中的鉛 |
Pb |
|
|
7(c)3 |
Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
額定電壓低于125V AC或250V DC的電容，其內的介電陶瓷中的鉛 |
Pb |
豁免到期:2013/01/01
豁免范圍:2013/01/01前年投放在市場上的電子電機產品的備用零件 |
|
7(c)-IV |
Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors壓電陶瓷介電陶瓷材料的電容器的鉛，該電容器為集成電路或分立半導體的組成部分 |
Pb |
|
|
9(b) |
Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications
含制冷劑的用于采暖，通風，制冷的壓縮機，其軸承外殼和襯套所使用的鉛. |
Pb |
|
|
11(a) |
Lead used in C-press compliant pin connector systems
C-press順應針連接系統中所使用的鉛 |
Pb |
豁免范圍:2010/09/24前年投放在市場上的電子電機產品的備用零件 |
|
11(b) |
Lead used in other than C-press compliant pin connector systems
除C-press外的順應針連接系統中所使用的鉛. |
Pb |
豁免到期:2013/01/01
豁免范圍:2013/01/01前年投放在市場上的電子電機產品的備用零件 |
|
12 |
Lead as a coating material for the thermal conduction module C-ring
導熱模組C-ring中的涂層材料所使用的鉛 |
Pb |
之后豁免:2010/09/24前年投放在市場上的電子電機產品的備用零件 |
|
13(a) |
Lead in white glasses used for optical applications
光學應用的白色玻璃中的鉛 |
Pb |
|
|
13(b) |
Cadmium and lead in filter glasses and glasses used for reflectance standards
濾光玻璃及反射標準用的玻璃所含的鉛 |
Pb |
|
|
14 |
Lead in solders consisting of more than two elements for the connection between the pins and the package of microproprocessors with a lead content of more than 80 % and less than 85 % by weight
用于引腳和封裝后微處理器之間連接的焊錫，若此焊錫為2種以上的元素組成，則其含鉛量可介于80%~85%. |
Pb |
豁免到期:2011/01/01
之后豁免:2010/09/24前年投放在市場上的電子電機產品的備用零件 |
|
15 |
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated
circ, uit flip chip packages
集成電路倒裝芯片封裝中半導體芯片及載體之間形成可靠聯接所用的鉛 |
Pb |
|
|
16 |
Lead in linear incandescent lamps with silicate coated tubes
線型鎢絲燈中燈管若有涂布硅酸鹽，則鉛可豁免 |
Pb |
豁免到期:2013/12/01 |
|
17 |
Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications
用于專業復印設備的高強度放電燈(HID)中用作激發的鹵素鉛 |
Pb |
|
|
18(a)
|
Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
特殊用途的放電燈，例如用于含二氮化合物的電子翻印、平板印刷、捕蟲燈、光化學或樹脂硬化過程，其中含有磷，例如SMS ((Sr,Ba)2MgSi2O7:Pb) ，則放電燈中的熒光粉，其鉛作為觸發源，鉛含量≤1%。
|
Pb |
豁免到期:2011/01/01 |
|
18(b) |
Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun
tanning lamps containing phosphors such as BSP (BaSi2O5:Pb)
防日曬的放電燈，其中含有磷，例如BSP (BaSi2O5:Pb) ，則放電燈中的熒光粉，其鉛作為觸發源，鉛含量≤1%。 |
Pb |
|
|
19
|
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)
鉛作為主要汞齊合金的特定成分(如PbBiSn-Hg和PbinSg-Hg)，且此汞齊作為主要汞齊，或如PbSn-Hg用于輔助汞齊中，且這些汞齊使用于緊湊型節能燈(ESL)中，則可含鉛
|
Pb |
豁免到期:2011/06/01 |
|
20
|
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal
Displays (LCDs)
液晶顯示器(LCD)中用于保護平面熒光燈前后支撐物用的玻璃中的氧化鉛
|
Pb |
豁免到期:2011/06/01 |
|
21 |
Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime
glasses
用于硼硅酸鹽玻璃瓷漆的印墨所含的鉛和鎘 |
Pb,Cd |
|
|
23 |
Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and less
間距為0.65mm或更小的細間距元件(連接件除外)，所使用的鉛 |
Pb |
豁免范圍:2010/09/24前年投放在市場上的電子電機產品的備用零件 |
|
24 |
Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
通孔盤狀和平面陣列陶瓷多層電容器中的焊料，所使用的鉛 |
Pb |
|
|
25 |
Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring
表面傳導式電子發射顯示器（SED）的部件(尤其是密封玻璃及玻璃環)中的氧化鉛 |
Pb |
|
|
26
|
Lead oxide in the glass envelope of black light blue lamps
淺藍黑燈管（BLB）玻璃外罩所含的氧化鉛
|
Pb |
豁免到期:2011/06/01 |
|
27
|
Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers
在大功率揚聲器(設計在125dB SPL或以上使用數小時)中作為轉換器焊料的鉛合金
|
Pb |
豁免到期:2010/09/24 |
|
29 |
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC
指令69/493/EEC附件I（第1、2、3和4類）中定義的水晶玻璃中的鉛 |
Pb |
|
|
31 |
Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting)
無汞平板熒光燈內焊接材料中的鉛（例如用于液晶顯示器、設計或工業照明） |
Pb |
|
|
32 |
Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes
用于氬和氪激光管窗體組件制造的密封釉料所使用的氧化鉛 |
Pb |
|
|
33 |
Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers
直徑100μm的細銅線和小于直徑100μm的電力變壓器中的焊料所使用的鉛； |
Pb |
|
|
34 |
Lead in cermet-based trimmer potentiometer elements
金屬陶瓷質的微調電位器中的鉛含量 |
Pb |
|
|
37 |
Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body
以硼酸鋅玻璃體為基礎的高壓二極管的電鍍層的鉛含量 |
Pb |
|
|
9 |
Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up
to 0,75 % by weight in the cooling solution
吸收式冷柜中碳鋼冷卻系統上用到的防腐蝕劑，其使用的六價鉻不得超過冷卻液的0.75%. |
Cr(VI) |
|
|
8(a) |
Cadmium and its compounds in one shot pellet type thermal cut-offs
用于溫度保險絲中的鎘及其化合物 |
Cd |
豁免到期:2012/01/01
豁免范圍:2012/01/01前年投放在市場上的電子電機產品的備用零件 |
|
8(b) |
Cadmium and its compounds in electrical contacts
電子觸點中的鎘及其化合物 |
Cd |
|
|
30 |
Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in
transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more
音壓在100分貝以上的大功率揚聲器中，連接音圈轉換器電導體與電氣/機械的焊料所使用的鎘合金 |
Cd |
|
|
38 |
Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide
用氧化鈹連接鋁制成的厚膜漿料中鎘和氧化鎘的含量 |
Cd |
|
|
39 |
Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state
illumination or display systems
用于固態照明或顯示系統中的顏色轉換II - VI族發光二極管(小于10 ug/mm2的發光區域)，所使用的鎘 |
Cd |
豁免到期:2014/07/01 |
|
40 |
Cadmium in photoresistors for analogue optocouplers applied in professional audio equipment
專業的聲頻設備中使用的模擬光耦合器中的光敏電阻器中的鎘 |
Cd |
豁免到期:2013/12/31 |
